Assembly

The newly renovated 825 sq. ft. HiDEC Packaging Assembly Lab is located in ENRC-350A. Approximately 200 sq. ft. of the lab is a class 10,000 cleanroom area. This lab houses all the equipment necessary to complete the final stages of most electronic packaging processes, including wafer dicing, wire bonding, soldering, and flip-chip attachment.

Through staff-taught, graduate-level courses offered at the Center, students can learn basic operating principles and gain hands-on experience with nearly all the equipment found in the Lab. Students that take the course are more productive in their own research and, in addition, gain valuable experience which makes them attractive to potential employers.

For more information on the processes and tools available in this lab, please choose from the menu.